ISTA European Packaging Symposium lines up strong speakers

Organised by the International Safe Transit Association (ISTA), with the support of Spain’s ITENE, ISTA’s seventh European Packaging Symposium will run from 5-7 March 2019 in Amsterdam, the Netherlands, with the theme of ‘Industry 4.0: Packaging Innovation and Impacts in a Transforming World.’
Following on from an evening reception on 5 March, organisations making presentations on 6 and 7 March will include Amazon, IBM, Intel, IKEA, HP, Smurfit Kappa and Sealed Air. Alongside ISTA and ITENE, IAPRI members Safe Load Testing Technologies and Fraunhofer IML will also be delivering presentations.
IBM will talk about shipping damage data analytics, while Intel will focus on developments with insulated containers, and Amazon will provide a case study.
ISTA’s Eric Hiser will discuss how to keep pace with evolving retail, Fraunhofer IML will look at the impacts of digitalisation, ITENE will present on critical distribution parameters for fresh products, while Safe Load Testing will discuss cosmetics industry examples.
The Symposium will take place at Amsterdam’s Marriot Hotel.